(中南大學(xué) 材料科學(xué)與工程學(xué)院，長沙 410083)
摘 要: 采用噴射沉積與熱壓相結(jié)合的方法制備電子封裝用70%Si-Al合金坯料，采用掃描電鏡和金相顯微鏡觀察合金的顯微組織。結(jié)果表明：采用噴射沉積與熱壓相結(jié)合的方法可獲得直徑為76.2 mm、厚度為6 mm的70%Si-Al合金樣品；合金中初晶Si的長大受到抑制，初晶Si相的尺寸僅為20~50 μm，分布均勻且形成連續(xù)骨架；Al相圍繞Si相間隙呈連續(xù)網(wǎng)絡(luò)分布，這種結(jié)構(gòu)有利于提高材料熱導(dǎo)率，降低其線膨脹系數(shù)；通過與后續(xù)熱壓相結(jié)合制備的70%Si-Al合金樣品，其室溫?zé)釋?dǎo)率達(dá)到110 W/(m·K)，400 ℃時線膨脹系數(shù)僅為9.6×10−6/K。
關(guān)鍵字: 70%Si-Al合金；電子封裝；熱導(dǎo)率；噴射沉積
（School of Materials Science and Engineering, Central South University, Changsha 410083, China）
Abstract: 70%Si-Al alloy was prepared by spray deposition and hot pressing technology. The microstructures of the alloy were investigated by scanning electron microscopy and metallographic microscopy. The results show that by spray deposition and hot pressing technology 70%Si-Al alloy with a diameter of 76.2 mm and a thickness of 6 mm can be obtained. The growth of primary silicon in 70%Si-Al alloy can be inhibited, and its grain size is only 20~50 μm. The distribution of primary silicon forms a continuous framework and the Al phase encircles the interval of Si phase continuously. The increase of thermal conductivity and decrease of the coefficient thermal expansion are mainly because of this structure. Its thermal conductivity reaches up to 110 W/(m∙K) at room temperature and the coefficient of thermal expansion is just 9.6×10−6/K.
Key words: 70%Si-Al alloy; electronic packaging; thermal conductivity; spray deposition
