(湖南大學 材料科學與工程學院，長沙 410082)
摘 要: 采用共混改性的聚雙馬來酰亞胺樹脂(PBMI)/腰果殼油改性酚醛樹脂(YM)為粘結劑，添加導電相、潤滑相和增強纖維相，利用熱軋混料，二次熱模壓及通氫固化等工藝制得改性樹脂基受電弓滑板試樣。利用TG、DTG和DSC分析方法對樹脂基體進行熱分析，通過環(huán)塊磨損試驗機對滑板/銅環(huán)的高溫、干態(tài)磨損性能進行測試，利用SEM方法對滑板的磨損形貌進行觀察和分析，進而探討滑板/銅環(huán)的熱態(tài)磨損機制。結果表明：PBMI/YM改性樹脂的耐熱性優(yōu)于YM樹脂，PBMI/YM改性樹脂基滑板的耐磨性明顯優(yōu)于YM樹脂基滑板。在環(huán)境溫度為350 ℃、磨損時間為30 min時，YM樹脂基滑板的磨損率和摩擦因數(shù)分別為23.57×10−7 cm3/(N·m)和0.232；而PBMI/YM改性樹脂基滑板的則分別為9.88×10−7 cm3/(N·m)和0.144。在磨損過程中，隨著環(huán)境溫度的增加，樹脂基滑板/銅環(huán)的磨損機制發(fā)生由粘著磨損向伴隨有輕微剝層磨損的熱磨損轉變。
關鍵字: PBMI/YM；樹脂基滑板；共混；熱態(tài)磨損；磨損機制
（College of Materials Science and Engineering, Hunan University, Changsha 410082, China）
Abstract:Abstract: With polybismaleimide resin(PBMI)/cashew nut oil modified phenol formaldehyde resin(YM) as bonding agent, and other electric conductive phase, lubricating phase and intensifier fiber, modified resin-matrix pantograph contact strip was produced by the processes of hot rolling, dually heated die-pressing and hydro-solidification technology. The thermal properties of resin matrix were characterized by TG , DTG and DSC. The wear properties of the contact strip against copper were evaluated by the ring block wear tester at elevated temperature under dry sliding conditions. The morphologies of the worn surfaces of YM and PBMI/YM contact strip samples were examined by scanning electron microscope(SEM), and the wear mechanism of the contact strip against copper was also studied. The experimental results indicate that the heat resistance of the PBMI/YM modified resin is better than that of the YM resin. The PBMI/YM modified resin-matrix contact strip against copper has superior wear resistance at elevated temperature than that of unmodified one under the same conditions. At initial environmental temperature of 350℃ and wear time of 30 min, the wear rate and the kinetic friction coefficient of the YM resin-matrix contact strip are 23.57×10−7 cm3/(N·m) and 0.232; while those of the PBMI/YM modified resin-matrix contact strip are 9.88×10−7 cm3/(N·m) and 0.144. At elevated temperature, the wear mechanism of the resin-matrix contact strip against copper evolves from adhesion wear to thermal wear with slight delamination wear.
Key words: PBMI/YM; resin-matrix contact strip; blending modification; thermal wear; wear mechanism
