(北京科技大學 材料科學與工程學院，北京 100083)
摘 要: 制備硼硅酸鹽玻璃包覆純銅微絲，其主要尺寸范圍為：銅絲直徑4~30 µm，玻璃包覆層厚度2~8 µm；對微絲的耐腐蝕性能和電學性能進行評價。結果表明：玻璃包覆純銅微絲在中性鹽霧實驗條件下，抗潮熱鹽霧腐蝕時間在240 h以上；對于外徑25 μm、包覆層厚度3.2 μm和外徑18 μm、包覆層厚度2.5 μm玻璃包覆純銅微絲，平均擊穿電壓分別達到1 174 V和774 V，耐擊穿電壓分別在1 050 V和660 V以上；外徑25 μm、包覆層厚度3.2 μm的玻璃包覆純銅微絲抗軟化擊穿溫度大于400 ℃。
關鍵字: 玻璃包覆純銅微絲；鹽霧腐蝕；擊穿電壓；軟化擊穿溫度
（School of Materials Science and Engineering, University of Science and Technology Beijing, ）
Abstract:Abstract: The glass-coated pure copper microwires were prepared by self-designed experimental equipment. The copper fiber diameter was 4−30 µm and the thickness of glass-coated layer was 2−8 µm. The anti-corrosion and electrical properties of the microwires were also evaluated. The results show that the resisting salt spray corrosion time of the microwires is above 240 h in neutral salt spray test; the average breakdown voltages of the microwires with 25 μm in outer diameter and 3.2 μm in thickness of glass-coated layer and with 18 μm in outer diameter and 2.3 μm in thickness of glass-coated layer are 1 174 V and 774 V, respectively; the anti-breakdown voltages are above 1 050 V and 660 V; the cut through temperature of the microwire with 25 μm in outer diameter and 3.2 μm in thickness of glass-coated layer is above 400 ℃.
Key words: glass-coated pure copper microwire; salt spray test; breakdown voltage; cut through temperature
