(1. 東南大學(xué) 材料科學(xué)與工程學(xué)院，南京 211189；2. 河海大學(xué) 材料科學(xué)與工程學(xué)院，南京 210098)
摘 要: 以純Al 粉為滲劑、NHCl4作為活化劑、雞蛋清為粘結(jié)劑、Cu基體鍍Ni層表面滲Al。研究經(jīng)800 ℃保溫12 h后的滲鋁層的表面形貌、組織、厚度和截面元素分布，分析滲鋁過程的機(jī)理。結(jié)果表明：滲鋁處理后Cu-Ni界面結(jié)合良好。滲鋁層組織為單一的富Al的Ni2Al3金屬間化合物。滲鋁層厚度為200 μm，平均顯微硬度HV達(dá)到1 100。Al的沉積和運(yùn)輸主要依靠AlCl2完成。
關(guān)鍵字: 銅；電鍍；鎳；Ni2Al3金屬間化合物；漿料包滲法
（1. School of Materials Science and Engineering, Southeast University,Nanjing 211189, China;2. School of Materials Science and Engineering, Hohai University,Nanjing 210098, China）
Abstract:The surface of the electro-deposited nickel layer on copper matrix was aluminized by a slurry pack cementation process. Using aluminum powders as doner, NH4Cl as the activator and albumen (egg white) as the cohesive agent. The surface morphology, the thickness，the phases and the elements distribution in the cross-section of aluminized layer fabricated at 800 ℃ for 12 h were studied, and the aluminizing mechanism was discussed. The results show that the interface of the Cu/Ni is bound excellently after aluminization. The microstructure of the aluminized layer is a single-phase Ni-rich Ni2Al3 intermetallic compound. The thickness of aluminized coating was 200 μm. The average micro hardness of the aluminized layer is HV 1 100. AlCl2 is responsible for the transportation and deposition of Al in the slurry pack.
Key words: copper; electro-deposition; nickel; Ni2Al3 intermetallic compound; slurry pack cementation
