(1. 北京科技大學 北京市腐蝕、磨蝕與表面技術重點實驗室，北京100083;2. 中國民用航空總局 航空安全技術中心，北京100028)
摘 要: 將LC4鋁合金進行硫酸陽極化處理，然后采用小電流密度(0.1 mA/cm2)進行鍍銅處理。XRD和EDS分析表明，小電流鍍銅的沉積產(chǎn)物為金屬銅，沉積的位置位于氧化膜多孔層的底部。結(jié)果表明，小電流鍍銅能夠使自腐蝕電位正移從而改善陽極氧化膜的耐蝕性。根據(jù)交流阻抗譜提出小電流鍍銅后陽極氧化膜的等效電路。沉積銅對陽極氧化膜的改性作用使材料具有銅的電化學特性，是耐蝕性提高的根本原因。小電流鍍銅處理與傳統(tǒng)的電解著色工藝有本質(zhì)區(qū)別，是一種新穎的提高陽極化鋁合金耐蝕性的后處理方法。
關鍵字: 鋁合金；陽極氧化膜；小電流鍍銅；改性；電解著色
（1. Beijing Key Laboratory for Corrosion, Erosion and Surface Technology University of Science and Technology Beijing, Beijing 100083, China,2. Center of Aviation Safety Technology, CAAC, Beijing 100028, China）
Abstract:Copper plating at a low current density (0.1 mA/cm2) was carried out on the anodic film of LC4 aluminum alloy. XRD and EDS results show that the deposition product is the metal of copper, which is deposited at the bottom of the porous layer of the anodic film. The polarization curves show that copper plating at a low current density (0.1 mA/cm2) can remarkably improve the corrosion resistance of the anodic film. The equivalent circuit of the anodic film after copper plating is presented according to the impedance spectroscopy. The primary cause of the improvement is that the material has the electrochemical characteristic of the copper by the modification of copper plating. Essential difference exists between the copper plating at the low current density (0.1 mA/cm2) and the traditional electrolytic coloring technology
Key words: aluminum alloy; anodic film; copper plating at low current density; modification; electrolytic coloring
