(1. 華南理工大學 機械工程學院，廣州 510641；
2. 廣州有色金屬研究院 材料表面中心，廣州 510651)
摘 要:
關鍵字: Sn-9Zn 釬料；無鉛釬料；Cu質(zhì)點；金屬間化合物
and Sn-9Zn/Cu-substrate
（1. College of Mechanical Engineering, South China University of Technology,
Guangzhou 510641, China;
2. Materials Surface Centre, Guangzhou Research Institute of Nonferrous Metals, Guangzhou 510651, China）
Abstract:The growth behavior of interfacial intermetallic compounds (IMCs) of Sn-9Zn/additive Cu-particles and Sn-9Zn additive Cu-substrate was investigated under the condition of extended soldering time. The results show that the Cu-Zn phases, which are composed of Cu5Zn8 and CuZn or Cu5Zn8, are formed at the interfaces of both Sn-9Zn/Cu-particles and Sn-9Zn/Cu-substrate, simultaneously the growth rate of IMCs of Sn-9Zn/Cu-particles is markedly higher than that of Sn-9Zn/Cu-substrate. It is also shown that the addition of Cu-particles in Sn-9Zn solder greatly reduces the thickness of IMCs layer of Sn-9Zn/Cu-substrate. The reliability for Sn-9Zn/Cu joint is improved for the diminished Zn content in soldering joint due to the in-situ formation of IMCs of Sn-9Zn/Cu-particles.
Key words: Sn-9Zn solder; lead-free solder; Cu-particle; intermetallic compound (IMCs)
