合金組織與性能的影響
(中南大學(xué) 材料科學(xué)與工程學(xué)院，長(zhǎng)沙 410083)
摘 要: 研究稀土Er含量對(duì)Sn-3.0Ag-0.5Cu無鉛焊料合金顯微組織以及性能的影響。結(jié)果表明：當(dāng)Er含量為0.05%~0.50%(質(zhì)量分?jǐn)?shù))時(shí)，對(duì)該無鉛焊料合金的導(dǎo)電性和腐蝕性影響不大，但使熔化區(qū)間溫度降低；當(dāng)Er含量為0.05%時(shí)，焊點(diǎn)剪切強(qiáng)度最高；當(dāng)Er含量為0.10%時(shí)，焊料鋪展面積最大，焊料潤(rùn)濕性有所改善，同時(shí)焊料的拉伸強(qiáng)度達(dá)到最高；當(dāng)Er含量為0.25%時(shí)，伸長(zhǎng)率最大。隨著Er含量的增加，該焊料合金的組織由樹枝晶向等軸晶轉(zhuǎn)變，且組織逐漸細(xì)化。Er的較佳添加量為0.05%~0.25%。
關(guān)鍵字: 無鉛焊料；Sn-3.0Ag-0.5Cu；Er；組織；性能
Sn-3.0Ag-0.5Cu lead-free solder alloy
（School of Materials Science and Engineering, Central South University,Changsha 410083, China）
Abstract:Trace rare earth element Er was added into Sn-3.0Ag-0.5Cu solder to investigate the effect of rare earth on the microstructure and mechanical properties of SnAgCu solder. The results show that, when Er content(mass fraction) is within 0.05%−0.50%, the Er has a slight effect on the resistivity and corrosion, and lowers the melting range. When Er content is 0.05%, the shear strength is the highest. When Er content is 0.10%, the spreading area is the biggest and the tensile strength is the highest. When Er content is 0.25%, the elongation is the highest. With the increase of Er content, the microstructure of the solder changes from fir-tree crystal to equiaxed crystal and is refined. And the suitable content of Er is within 0.05%−0.25%.
Key words: lead-free solder; Sn-3.0Ag-0.5Cu; Er; microstructure; property
