(大連理工大學(xué) 材料科學(xué)與工程學(xué)院，大連 116024)
摘 要: 對(duì)Sn-9Zn-xCu釬料在3.5%NaCl溶液中的電化學(xué)腐蝕行為進(jìn)行研究，以揭示添加Cu對(duì)Sn-9Zn釬料耐蝕性的影響。結(jié)果表明：添加Cu元素使Sn-Zn釬料的腐蝕電位有所增加，即添加Cu元素可以改善Sn-Zn釬料的耐腐蝕性能；XRD檢測(cè)發(fā)現(xiàn)Sn-9Zn-xCu釬料的腐蝕產(chǎn)物中存在Zn5(OH)8Cl2∙H2O；隨著Cu含量的增加，Zn5(OH)8Cl2∙H2O的量逐漸減少，出現(xiàn)Cu的腐蝕產(chǎn)物，腐蝕表面趨于均勻平整，選擇性腐蝕減弱，腐蝕產(chǎn)物的黏附性較好。
關(guān)鍵字: 無鉛釬料；Sn-Zn-Cu釬料；NaCl溶液；電化學(xué)腐蝕
（School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China）
Abstract:The electrochemical corrosion behavior of lead-free Sn-9Zn-xCu(x=0−6) solder in 3.5% NaCl solution was studied, in order to reveal the effect of Cu on the corrosion resistance of Sn-9Zn solder. The results indicate that the corrosion potential increases with increasing the addition of Cu, so Cu can improve the corrosion resistance of Sn-Zn solders. XRD results indicate that Zn5(OH)8Cl2∙H2O exists in the corrosion products of Sn-9Zn-xCu. With increasing Cu content, the quantity of Zn5 (OH)8Cl2∙H2O decreases, the corrosion products containing Cu form, the surface tends to be smooth, and the selective oxidation weakens.
Key words: free-lead solder; Sn-Zn-Cu solder; NaCl solution; electrochemical corrosion
