中國有色金屬學(xué)報(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 20 Special 3 September 2010 |
XU Feng(徐 峰), LI Xian-hui(黎先輝)
（School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China）
Abstract:The rapid development of electronic packaging industry has resulted in higher requirement for packaging materials. The packaging material of SiC reinforced A356 aluminum alloy was fabricated by mechanical mixing method, and the SiCp/Al composite billet was formed by thixo-forging to manufacture the electronic packaging shell. The microstructure of the produced part was investigated. Two different thixo-forging procedures for manufacturing electronic packaging shell were analyzed. The results show that after being heated to 600℃ and held for 3 h, SiCp has good compatibility with A356 aluminum alloy and the SiCp/A356 composite billet can meet the requirements of thixo-forging. When the billet was remelted to 580℃, held for 10 min, the homogeneous microstructure with the best thixo-formability can be realized. The thixo-forging of electronic packaging shell is feasible.
Key words: SiCp/Al composite; electronic packaging shell; thixo-forging; microstructure
