中國有色金屬學(xué)報(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 17 Special 1 November 2007 |
electronic packaging
XIU Zi-yang(修子揚(yáng))2, YU Kun(余 琨)1
（1. School of Materials Science and Engineering, Central South University, Changsha 410083, China;
2. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China）
Abstract:In order to improve the thermal properties of MMCs for electronic packaging, the concept of fabrication MMCs with particular interpenetrating phases(IPCs) was proposed. Based on the diffusion theory of reinforcement element in matrix alloys of some particular PMMCs, a novel fabrication method to produce IPCs was proposed. The Si/Al composites (65%Si, volume fraction) with interpenetrating phases were fabricated successfully by squeeze casting and hot press sintering technology. Microstructure observations indicate that the reinforcements Si are of three-dimensional continuous network and the composites are compact without obvious defects. The average linear thermal expansion coefficient (CTE) between 20 ℃ and 100 ℃ of the Si/Al IPCs is 8.27×10−6/K, and the thermal conductivity(TC) is 124.03 W/(m∙K), and the composites can meet the demands of electronic packaging. ROM model and Turner model can be used to predict the CTEs of IPCs, and the experimental , CTEs are between their theoretical and calculated values.
Key words: fabrication method; interpenetrating phase composites; Si/Al alloy; electronic packaging
