Abstract: For the electronic packaging applications, copper matrix composites reinforced with different sized SiC particles (10μm, 20μm and 63μm) were fabricated by squeeze casting technology. And the effect of particle size on their thermo-physical properties was discussed. The composites are free of porosity and the SiC particles are distributed uniformly in the composites. It is found that the mean linear thermal expansion coefficients(20-100℃) of SiC_p/Cu composites are in the range of (8.4-9.2)×10^-6/℃, and smaller expansion coefficient can be obtained for the composites with finer SiC particles because of the larger restriction in expansion through interfaces. Their thermal conductivities are reduced with the decrease of SiC sizes. This is attributed to the fact that the negative effect of interfacial thermal resistance becomes increasingly dominant as the particles becomes smaller.

Key words: particle size; copper matrix composites; thermal expansion; thermal conductivity