中國有色金屬學(xué)報(bào)(英文版)
Transactions of Nonferrous Metals Society of China
| Vol. 34 No. 8 August 2024 |
（1. School of Engineering, Faculty of Innovation & Technology, Taylor’s University, Subang Jaya, 47500, Selangor, Malaysia;
2. Faculty of Mechanical Engineering & Technology, Universiti Malaysia Perlis (UniMAP), Pauh Putra Campus, 02600 Arau, Perlis, Malaysia;
3. Lee Kong Chian Faculty of Engineering and Science, Universiti Tunku Abdul Rahman, Jalan Sungai Long, Bandar Sungai Long, 43000 Kajang, Selangor, Malaysia）
Abstract:The influence of Mo and ZrO2 nanoparticles addition on the interfacial properties and shear strength of Sn58Bi solder joint was investigated. The interfacial microstructures of Sn58Bi/Cu, Sn58Bi + Mo/Cu and Sn58Bi + ZrO2/Cu solder joints were analysed using a scanning electron microscope (SEM) coupled with energy dispersive X-ray (EDX) and the X-ray diffraction (XRD). Intermetallic compounds (IMCs) of MoSn2 are detected in the Sn58Bi + Mo/Cu solder joint, while SnZr, Zr5Sn3, ZrCu and ZrSn2 are detected in Sn58Bi + ZrO2/Cu solder joint. IMC layers for both composite solders comprise of Cu6Sn5 and Cu3Sn. The SEM images of these layers were used to measure the IMC layer’s thickness. The average IMC layer’s thickness is 1.4431 μm for Sn58Bi + Mo/Cu and 0.9112 μm for Sn58Bi + ZrO2/Cu solder joints. Shear strength of the solder joints was investigated via the single shear lap test method. The average maximum load and shear stress of the Sn58Bi + Mo/Cu and Sn58Bi + ZrO2/Cu solder joints are increased by 33% and 69%, respectively, as compared to those of the Sn58Bi/Cu solder joint. By comparing both composite solder joints, the latter prevails better as adding smaller sized ZrO2 nanoparticles improves the interfacial properties granting a stronger solder joint.
Key words: lead-free solder; interfacial microstructure; IMC layer thickness; shear strength; dislocation density; ZrO2 nanoparticles; Mo nanoparticles
